余隙孔2:acrylic fitting
压克力配件3:adesive
胶粘剂4:adhesive coated foil
涂胶铜箔5:adhesive faec
胶粘剂面6:all drilled hole
全部钻孔7:amorphous polymer
无定形聚合物8:anchoring spaur
盘址9:annealed copper foil
退火铜箔10:annular pad
环形盘11:annular ring
孔环12:any layer inner via hole
任意层内部导通孔13:aromatic polyamide paper
聚芳酰胺纤维纸14:array
阵列15:artificial lamp / light
工艺灯16:artificial lamp/light
工艺灯17:assembled lamp / light
组合灯18:assembled lamp/light
组合灯19:assembly drawing
装配图20:A-stage resin A
阶树脂21:B2it printed board
埋入凸块连印制板22:back-bard land
腹(背)裸盘23:backplane
背板24:Band gap voltage reference
带隙电压参考25:Banner lighting company
倍尔诺照明26:bare board
裸板27:base film surface
基膜面28:base material
基材29:basis material
基体材料30:beat frequency
拍频31:bench top supply
工作台电源32:bias
纬斜33:binder
粘结剂34:bismaleimide-triazine resin
双马来酰亚胺三嗪树脂35:blind via (hole)
盲孔36:block diagram
方块框图37:board
板38:Bode Plot
波特图39:bonding layer
粘结层40:bonding sheet
粘结片41:bottom-up design
自底向上设计42:bow of weave
弓纬43:break-away planel
可断拼板44:breaking length
断裂长45:brominated epoxy resin
溴化环氧树脂46:Bromine tungsten lamp
溴钨灯47:B-stage resin B
阶树脂48:bucket capacitor
桶形电容49:buile-up printed board
积层印制板50:bullet pad
子弹形盘51:buried resistance board
埋电阻板52:buried via hole
埋孔53:candela
光强度单位坎德拉54:car lamp
车灯55:carrier foil
载体箔56:ceiling lamp / light
吸顶灯57:ceramic fitting
陶瓷配件58:chandeliers
枝状大吊灯59:charge pump
电荷泵60:chassis
机架61:chip on board
载芯片板62:Christmas lamp / light
圣诞灯63:Christmas lamp/light
圣诞灯64:circit simulation
电路模拟65:circuit breaker
断路器66:Co1or Temperature
色温67:coconut lamp / light
椰树灯68:coconut lamp/light
椰树灯69:Color rendering
演色性70:Color Temperature
色温71:commutator
整流器72:Compact Fluorescent Lamp
节能灯(紧凑型荧光灯)73:Compact Fluorescent lamp(2u 3u 4u)
节能灯74:component density
元件密度75:component hole
元件孔76:component positioning
元件安置77:component side
元件面78:composite laminate
复合层压板79:composite metallic material
复合金属箔80:computer aided drawing
计算机辅助制图81:computer controlled display
计算机控制显示82:conduction (track)
导线(通道)83:conductive foil
导电箔84:conductive pattern
导电图形85:conductor layer
导线层86:conductor layer No.1
第一导线层87:conductor line/space
导线宽度/间距88:conductor side
导线面89:conductor spacing
导线距离90:conductor trace line
导线91:conductor width
导线(体)宽度92:constant current source
恒流源93:copper foil
铜箔94:copper-clad laminate (CCL)
覆铜箔层压板95:copper-clad surface
铜箔面96:copper-invar-copper board
键盘板夹心板97:core material
内层芯板98:Core Saturation
铁芯饱和99:cost metrix
费用矩阵100:couplint agent
偶联剂101:cover layer (cover lay)
覆盖层102:crease
折痕103:cross wise direction
模向104:crossover
跨交105:crossover frequency
交叉频率106:crystal lamp / light
水晶灯107:crystalline polamer
结晶现象108:C-stage resin C
阶树脂109:curing agent
固化剂110:current ripple
纹波电流111:current-limiting
限流器112:cut to size panel
剪切板113:Cycle by Cycle
逐周期114:cycle skipping
周期跳步115:datum referan
参考基准116:daughter board
子板117:Dead Time
死区时间118:definite sequence
定顺序119:degrees freedom
自由度120:denier
但尼尔121:design database
设计数据库122:design origin
设计原点123:design rule checking
设计规则检查124:D-glass fibre D
玻璃纤维125:diamond pad
菱形盘126:DIE Temperature
核心温度127:die-casting fitting
压铸件128:digitzing
数字化129:dimensioned hole
准尺寸孔130:dimmer
调光器131:dimorphism
双晶现象132:Disable
非使能，无效，禁用，关断133:dis-casting fitting
压铸件134:discrete wiring board
散线印制板135:dominant pole
主极点136:double treated foil
双面处理铜箔137:down lamp / light
筒灯138:down lamp/light
筒灯139:drill drawing
钻孔图140:drive file
驱动文件141:dropout voltage
压差142:dynamic flex board
动态挠性板143:edge-board contact
板边插头144:E-glass fibre E
玻璃纤维145:electric wire / power cored
电线146:electric wire/power cored
电线147:electronic ballast
电子镇流器148:Electronic Ballasts
电子镇流器149:electronic senor light / lamp
电子感应灯150:electronic senor light/lamp
电子感应灯