bonding agent[胶粘] 粘合剂;将单层粘合形成多层板的胶剂;键合剂
WIRE BONDING打线结合;线接合
bonding orbital[物化] 成键轨道;键轨函数;成键轨函数
ball bonding[电子] [机] 球焊;球形焊接;球形接合;球形键合
Metallic Bonding金属键
bonding adhesive芯片键合用粘合剂;胶粘剂
bonding pair成键电子对;键对;计算键对
bonding bar等电位连接带;等电位联结带
chip bonding芯片焊接;芯片级焊接
Based on the results of Mindlin, the calculation method of shearing stress and axial force of full-grouted bolt were obtained. The bonding mechanism of between full-grouted bolt and slurry, between slurry and surrounding rock were discussed.
基于半空间问题的位移解,给出了全长粘结锚杆杆体所受的剪应力和轴力的计算方法,探讨了粘结锚杆杆体与浆体以及浆体与围岩的粘结机理。
Firstly, the bonding basic principle and the common course of bonding technology are briefly recounted.
首先简要叙述了粘接的基本原理、粘接工艺的一般过程。
参考来源 - 碳纤维蒙皮与肋板粘接过程的仿真分析The parameters of FAB (free air ball) process during copper wire bonding were optimized.
对铜丝球键合焊形球过程FAB参数进行了优化。
These analyses reveal that the bonding interactions are dominated by the π-back-donation although σ-donation plays a significant role.
分析结果显示，虽然σ轨道在成键过程中扮演了主要角色，但是对吸附起决定作用的却是π轨道。
Moreover, the COPS has small size, simple structure and strong anti-interference ability.2) Set up a CO2 laser bonding equipment.
2)搭建了CO2激光焊接装置。
参考来源 - 基于紧凑型光程扫描器光纤传感解调系统的研究Culcination temperature and time influence the self-generated oxide layer, and then act on the coating’s quality and bonding strength.
煅烧温度和时间通过对自生氧化层的作用影响涂层质量和结合强度。
Therefore the research work is carried out to use nano-technology to improve cement material so as to reset network structure and to increase interface bonding.
因此文中探讨了应用纳米技术对水泥材料进行改进性的研究 ,以重整其网络结构 ,增加界面键合。
参考来源 - 柔性层压织物基材表面润湿与粘合性能的研究N（名词） the process by which individuals become emotionally attached to one another 形成的密切关系的过程 → see also pair bond