The effects of the curing process of the underfill on the vertical crack stress on top of the die, maximum equivalent stress of the low-k layer and equivalent plastic stain of the solder joint were investigated by finite element software.

通过有限元软件研究了底充胶固化工艺对芯片上方垂直开裂应力、焊点等效塑性应变及低k层最大等效应力的影响。

The early studies usually described the underfill materials as classical linear elasticity in order to get a better computational efficiency. But the underfill shows significant viscoelasticity actually.

不同的材料模型对有限元模拟的结果会产生直接的影响,以往的研究通常会将下填料的材料模型简化为经典线弹性模型,以提高计算效率,但这与下填料表现的粘弹性特征有明显的区别。