warpage test翘曲试验;翘曲实验
Camber Warpage翘曲
wafer warpage薄片弯曲
Warpage Predict变形量预测
warpage compensation变形补偿
board warpage电路板扭曲
Warpage Resistance不易翘曲
silicon warpage翘曲
Warpage Remove压板翘
The results showed that the warpage was mainly caused by GF orientation; the disortion degree could be decreased effectively by increasing part thickness or mould gates.
结果表明,GF的取向是影响PA66/GF注射成型制品翘曲变形的主要原因;增加制品厚度或增设浇口均可有效减小制品的翘曲变形。
参考来源 - 玻璃纤维增强PA66制品翘曲变形的研究And the warpage of PBGA package is studied. The results show that temperature and thermal stress distribution are consistent with the experimental result.
考虑了PBGA封装体的封装热变形，数值分析结果显示温度与热应力的分布与文献中的实验结果一致。
参考来源 - 集成电路芯片封装的热—结构数值模拟分析及优化设计